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TUDelft PhD Researcher Position – Next Generation Micro-Assembly Processes

The Netherlands

TUDelft invites applications for a Ph.D. researcher position to investigate, design, implement, and test innovative interconnection materials and solutions compatible with ultra-high-throughput handling and accurate placement of chips, the Faculty of Electrical Engineering, Mathematics and Computer Science (EEMCS),  Delft University of Technology, The Netherlands – Jan 2022 (Opportunities for MSc degree holders in mechanical or mechatronic engineering, micro/nano engineering, engineering physics)

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General Info

No. of Positions:
Research Field: , ,
Deadline to Apply: Expired
Joining Date:
Contract Period:



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Qualification Details

You will be part of a team of 6 PhD and 2 postdoc researchers, that work together with staff scientists and engineers at TU Delft and the Dutch company Nexperia. Each of the researchers will work on a dedicated part of the project, while at the same time closely collaborating with the rest of the team to ensure all parts can eventually fit together to realize all steps that need to be performed in the chip-assembly process.

Candidates have a MSc degree in mechanical or mechatronic engineering, micro/nano engineering, engineering physics, or related fields. We are looking for candidates that can realize creative new solutions for dealing with the diverse challenges that accompany the accurate and fast manipulation of microchips, involving skills like experimental design, modeling, setup realization, automation, use of diverse sensor systems and (high-speed) vision systems.

The collaboration both with a team of fellow researchers and with a high-tech company that is a world leader in its business will give you the unique opportunity to learn a lot and contribute to a next generation of machines that will improve the assembly speed and reduce the environmental impact of hundreds of billions of future chips.

Responsibilities/Job Description

The market for electronic chips remains increasing, electronic functionality is part of all devices and products around us. In the manufacturing of electronic packages, machines are used to assemble chips (pick-and-place, bond and interconnect). Although the performance of these machines is impressive, there is the need to further increase the speed by a factor of 10-100. At the same time, machines must become “green”: use less energy, and have a small ecological footprint. The bottleneck is in the mechanical part of the assembly machine.

In a large direct collaborative project with the Dutch company Nexperia we research new generations of chip assembly processes to achieve these goals.

The current position focuses on developing and testing the reliability of novel chip-to-substrate interconnect technologies. As a PhD researcher you will investigate, design, implement, and test innovative interconnection materials and solutions compatible with ultra-high throughput handling and accurate placement of chips. You will mechanically and electrically characterize these solutions, and design and build experimental setups to demonstrate that they can lead to breakthrough performance in next-generation chip assembly machines.

How to Apply?

Online Application through "Apply Now" Button from this page

Reference Number: TUD01601
(If any, use it in the necessary place)

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Documents Required

Please apply no later than January 1, 2022 via the application button and upload your motivation and CV.

As part of your application documentation, provide (either in motivation letter or CV) a brief description of a recent scientific/technical achievement which in your view demonstrates your technical abilities as required in this position.

  • A pre-employment screening can be part of the selection procedure.
  • You can apply online. We will not process applications sent by email and/or post.
  • Acquisition in response to this vacancy is not appreciated.

About the Faculty

Faculty Electrical Engineering, Mathematics and Computer Science

The Faculty of Electrical Engineering, Mathematics and Computer Science (EEMCS) brings together three disciplines - electrical engineering, mathematics and computer science. Combined, they reinforce each other and are the driving force behind the technology we use in our daily lives. Technology such as the electricity grid, which our faculty is helping to make future-proof. We are also working on a world in which humans and computers reinforce each other. We are mapping out disease processes using single cell data, and using mathematics to simulate gigantic ash plumes after a volcanic eruption. There is plenty of room here for ground-breaking research. We educate innovative engineers and have excellent labs and facilities that underline our strong international position. In total, more than 1,100 employees and 4,000 students work and study in this innovative environment.

Click here to go to the website of the Faculty of Electrical Engineering, Mathematics and Computer Science.

About the Employer:

Conditions of Employment

TU Delft offers PhD-candidates a 4-year contract, with an official go/no go progress assessment after one year. Salary and benefits are in accordance with the Collective Labour Agreement for Dutch Universities, increasing from € 2434 per month in the first year to € 3111 in the fourth year. As a PhD candidate you will be enrolled in the TU Delft Graduate School. The TU Delft Graduate School provides an inspiring research environment with an excellent team of supervisors, academic staff and a mentor. The Doctoral Education Programme is aimed at developing your transferable, discipline-related and research skills.

The TU Delft offers a customisable compensation package, discounts on health insurance and sport memberships, and a monthly work costs contribution. Flexible work schedules can be arranged. For international applicants we offer the Coming to Delft Service and Partner Career Advice to assist you with your relocation.

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Contact details

For more information about this vacancy, please contact Dr. Massimo Mastrangeli,

For information about the application procedure, please contact Marjolein van der Heijden,

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